Media Release
Karkala, Jun 16: The invention ‘Scalable Modular Interconnect for Three-dimensional High-Performance Application- A new 3D topology for noc based systems’ of Dr Niranjan N Chiplunkar has been granted a patent by Indian Patent Office recently.
‘SMITHA’ is a new three-dimensional architecture that helps in designing applications that would run faster than the existing system in a multicore system. This also enables more logic to be implanted on silicon.
The invention is conceived and developed by Dr Niranjan N Chiplunkar, principal, NMAMIT, Nitte and Dr Sanju V, Associate Professor in the department of CSE, NITTE Meenakshi Institute of Technology, Yelahanka, Bengaluru and P Venkata Krishna, professor, VIT University, Vellore.